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Location: Home / Technology / Intel Sapphire Rapid-SP Xeon CPUs To Feature Up To 64 GB HBM2e Memory, Also Talks Next-Gen Xeon & Data Center GPUs For 2023+

Intel Sapphire Rapid-SP Xeon CPUs To Feature Up To 64 GB HBM2e Memory, Also Talks Next-Gen Xeon & Data Center GPUs For 2023+

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The current generation of Intel Xeon Scalable processors has been extensively adopted by our HPC ecosystem partners, and we are adding new capabilities with Sapphire Rapids – our next-generation Xeon Scalable processor that is currently sampling with customers. This next-generation platform delivers multi-capabilities for the HPC ecosystem, bringing for the first time in-package high bandwidth memory with HBM2e that leverages the Sapphire Rapids multi-tile architecture. Sapphire Rapids also brings enhanced performance, new accelerators, PCIe Gen 5 and other exciting capabilities optimized for AI, data analytics and HPC workloads.

Intel Sapphire Rapid-SP Xeon CPUs To Feature Up To 64 GB HBM2e Memory, Also Talks Next-Gen Xeon & Data Center GPUs For 2023+

HPC workloads are evolving rapidly. They are becoming more diverse and specialized, requiring a mix of heterogeneous architectures. While the x86 architecture continues to be the workhorse for scalar workloads, if we are to deliver orders-of magnitude performance gains and move beyond the exascale era, we must critically look at how HPC workloads are run within vector, matrix and spatial architectures, and we must ensure these architectures seamlessly work together.Intel has adopted an “entire workload” strategy, where workload-specific accelerators and graphics processing units (GPU) can seamlessly work with central processing units (CPU) from both hardware and software perspectives.

We are deploying this strategy with our next-generation Intel Xeon Scalable processors and Intel Xe HPC GPUs (code-named “Ponte Vecchio”) that will power the 2 exaflop Aurora supercomputer at Argonne National Laboratory. Ponte Vecchio has the highest compute density per socket and per nodes, packing 47 tiles with our advanced packaging technologies: EMIB and Foveros. There are over 100 HPC applications running on Ponte Vecchio. We are also working with partners and customers including – ATOS, Dell, HPE, Lenovo, Inspur, Quanta and Supermicro – to deploy Ponte Vecchio in their latest supercomputers.

via Intel